Single-Phase Jet Impingement Cooling for a Power-Dense Silicon Carbide Power Module

Ammar Osman, Gilberto Moreno, Steve Myers, Sreekant Narumanchi, Yogendra Joshi

Research output: Contribution to journalArticlepeer-review

2 Scopus Citations


The adoption of silicon carbide (SiC) devices in the electric vehicle (EV) industry is increasing due to their superior performance over silicon devices. SiC devices enable further miniaturization of EV inverters, increasing their power density, which results in thermal management challenges. In this article, the limits of single-phase jet impingement cooling are explored for an automotive SiC power module. We propose embedding pin fins in the direct-bonded-copper (DBC) substrate of the power module package using laser powder bed fusion (LPBF) additive manufacturing. The thermal-hydraulic performance of the DBC-embedded pin fins is compared against folded fins that are directly soldered to the DBC substrate. A heat conduction analysis was conducted on an SiC package to determine the target heat transfer coefficient (HTC) for the heat sink. A water-ethylene glycol (WEG) jet impingement on the proposed concepts was studied using unit-cell models to achieve the target HTC. The studied designs put emphasis on the reliability and manufacturability requirements of the automotive industry. The thermal performance of DBC-embedded pin fins outperformed the DBC-soldered folded fins. The performance of the DBC-embedded pin fins is benchmarked against WEG-based cooling systems of commercial EVs. With the proposed cooling solution, we have shown a pathway of reducing the specific thermal resistance by 75% compared to the BMW i3 thermal management system without any penalty on pressure drop or parasitic power.

Original languageAmerican English
Pages (from-to)615-627
Number of pages13
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Issue number5
StatePublished - 2023

Bibliographical note

Publisher Copyright:
© 2011-2012 IEEE.

NREL Publication Number

  • NREL/JA-5400-82097


  • Direct-bonded-copper (DBC)-embedded pin fins
  • folded fins
  • jet impingement
  • power electronics
  • silicon carbide (SiC) metal oxide semiconductor field-effect transistor (MOSFET)
  • single phase
  • textured surfaces


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