Abstract
Removing grown device layers from a GaAs substrate is an essential aspect of reducing costs of III-V photovoltaics. While many methods of device layer removal have been explored, Sonic Lift-off (SLO) demonstrates novel control of the stress conditions within the substrate during exfoliation. By utilizing acoustic energy, this technique allows for a lower maximum stress required to fully lift-off layers from a substrate. We demonstrate that this technique results in no damage to inverted-grown and upright-grown exfoliated devices. The inverted device demonstrated an efficiency of 26.8% after SLO in comparison to 26.5% for a traditionally-processed cell, and the upright device showed a 22.0% efficiency after SLO. The SLO process has been shown to produce exfoliated, damage-free devices and opens the door for substrate reuse to reduce the cost of III-V photovoltaics.
Original language | American English |
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Journal | Solar RRL |
DOIs | |
State | Published - 2025 |
NREL Publication Number
- NREL/JA-5900-87110
Keywords
- III-V
- photovoltaic
- spalling