Abstract
In this article, we explore the influence of module size on the rate of interconnecting solder bond thermomechanical fatigue (TMF) damage. Structural mechanics models of crystalline silicon PV models are created to solve with the finite-element method. Results conclusively demonstrate that the rate of solder bond TMF damage is independent of module size, interconnect location across the cell and cell location across the module.
Original language | American English |
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Article number | 9426839 |
Pages (from-to) | 1048-1050 |
Number of pages | 3 |
Journal | IEEE Journal of Photovoltaics |
Volume | 11 |
Issue number | 4 |
DOIs | |
State | Published - Jul 2021 |
Bibliographical note
Publisher Copyright:© 2011-2012 IEEE.
NREL Publication Number
- NREL/JA-5K00-79168
Keywords
- Accelerated testing
- fatigue
- modeling
- photovoltaic cells
- reliability
- soldering