Solder Bond Fatigue is Insensitive to Module Size

Research output: Contribution to journalArticlepeer-review

4 Scopus Citations

Abstract

In this article, we explore the influence of module size on the rate of interconnecting solder bond thermomechanical fatigue (TMF) damage. Structural mechanics models of crystalline silicon PV models are created to solve with the finite-element method. Results conclusively demonstrate that the rate of solder bond TMF damage is independent of module size, interconnect location across the cell and cell location across the module.

Original languageAmerican English
Article number9426839
Pages (from-to)1048-1050
Number of pages3
JournalIEEE Journal of Photovoltaics
Volume11
Issue number4
DOIs
StatePublished - Jul 2021

Bibliographical note

Publisher Copyright:
© 2011-2012 IEEE.

NREL Publication Number

  • NREL/JA-5K00-79168

Keywords

  • Accelerated testing
  • fatigue
  • modeling
  • photovoltaic cells
  • reliability
  • soldering

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