Solder Bond Fatigue is Insensitive to Module Size

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4 Scopus Citations


In this article, we explore the influence of module size on the rate of interconnecting solder bond thermomechanical fatigue (TMF) damage. Structural mechanics models of crystalline silicon PV models are created to solve with the finite-element method. Results conclusively demonstrate that the rate of solder bond TMF damage is independent of module size, interconnect location across the cell and cell location across the module.

Original languageAmerican English
Article number9426839
Pages (from-to)1048-1050
Number of pages3
JournalIEEE Journal of Photovoltaics
Issue number4
StatePublished - Jul 2021

Bibliographical note

Publisher Copyright:
© 2011-2012 IEEE.

NREL Publication Number

  • NREL/JA-5K00-79168


  • Accelerated testing
  • fatigue
  • modeling
  • photovoltaic cells
  • reliability
  • soldering


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