Abstract
InterPACK is a premier international forum for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of micro-electronics packaging. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD) founded in 1992 as an ASME-JSME joint biannual conference. Rapid changes in the semiconductor landscape together with findings from InterPACK Pathfinding workshop (IPW) in 2016 led to a significant reset of InterPACK conference priorities and focus to comprehensively address needs of the InterPACK community. As a result, starting in 2017, InterPACK has become an annual conference and the scope of the conference has increased significantly together with a systems-focus to include some of the most cutting-edge topics in electronics packaging, device integration, and reliability. These topics are organized across five different tracks: (1) heterogeneous integration: microsystems with diverse functionality, (2) servers of the future, (3) structural and physical health monitoring, (4) energy conversion and storage, and (5) transportation: autonomous and electric vehicles.
| Original language | American English |
|---|---|
| Article number | 010301 |
| Journal | Journal of Electronic Packaging, Transactions of the ASME |
| Volume | 140 |
| Issue number | 1 |
| DOIs | |
| State | Published - 1 Mar 2018 |
NREL Publication Number
- NREL/JA-5400-70930
Keywords
- 3D-printing
- advanced interconnect technologies
- automotive electronics reliability sensors
- data center cooling technologies
- microscale heat transfer