Special Section on InterPACK 2017 - Part 1: Paper No. EP-18-1005

Sreekant Narumanchi, Kaushik Mysore, Ercan Dede, Reza Khiabani

Research output: Contribution to journalArticlepeer-review


InterPACK is a premier international forum for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of micro-electronics packaging. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD) founded in 1992 as an ASME-JSME joint biannual conference. Rapid changes in the semiconductor landscape together with findings from InterPACK Pathfinding workshop (IPW) in 2016 led to a significant reset of InterPACK conference priorities and focus to comprehensively address needs of the InterPACK community. As a result, starting in 2017, InterPACK has become an annual conference and the scope of the conference has increased significantly together with a systems-focus to include some of the most cutting-edge topics in electronics packaging, device integration, and reliability. These topics are organized across five different tracks: (1) heterogeneous integration: microsystems with diverse functionality, (2) servers of the future, (3) structural and physical health monitoring, (4) energy conversion and storage, and (5) transportation: autonomous and electric vehicles.
Original languageAmerican English
Article number010301
JournalJournal of Electronic Packaging, Transactions of the ASME
Issue number1
StatePublished - 1 Mar 2018

NREL Publication Number

  • NREL/JA-5400-70930


  • 3D-printing
  • advanced interconnect technologies
  • automotive electronics reliability sensors
  • data center cooling technologies
  • microscale heat transfer


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