Strength of Si Wafers with Microcracks: A Theoretical Model; Preprint

    Research output: Contribution to conferencePaper


    This paper concentrates on the modeling of the strength of photovoltaic (PV) wafers. First a multimodal Weibull distribution is presented for the strength of a silicon specimen with bulk, surface, and edge imperfections. Next, a specific case is analyzed of a PV wafer with surface damage that takes the form of subsurface microcracks.
    Original languageAmerican English
    Number of pages7
    StatePublished - 2008
    Event33rd IEEE Photovoltaic Specialists Conference - San Diego, California
    Duration: 11 May 200816 May 2008


    Conference33rd IEEE Photovoltaic Specialists Conference
    CitySan Diego, California

    NREL Publication Number

    • NREL/CP-520-42556


    • fracture energy theory
    • large-area
    • multimodal Weibull distribution
    • PV
    • residual microcracks
    • silicon wafers
    • wafer breakage


    Dive into the research topics of 'Strength of Si Wafers with Microcracks: A Theoretical Model; Preprint'. Together they form a unique fingerprint.

    Cite this