Strength of Si Wafers with Microcracks: A Theoretical Model; Preprint

Strength of Si Wafers with Microcracks: A Theoretical Model; Preprint

Research output: Contribution to conference › Paper

Abstract

This paper concentrates on the modeling of the strength of photovoltaic (PV) wafers. First a multimodal Weibull distribution is presented for the strength of a silicon specimen with bulk, surface, and edge imperfections. Next, a specific case is analyzed of a PV wafer with surface damage that takes the form of subsurface microcracks.

Original language	American English
Number of pages	7
State	Published - 2008
Event	33rd IEEE Photovoltaic Specialists Conference - San Diego, California Duration: 11 May 2008 → 16 May 2008

Conference

Conference	33rd IEEE Photovoltaic Specialists Conference
City	San Diego, California
Period	11/05/08 → 16/05/08

NREL Publication Number

NREL/CP-520-42556

Keywords

fracture energy theory
large-area
multimodal Weibull distribution
PV
residual microcracks
silicon wafers
wafer breakage

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

Access to Document

https://www.nrel.gov/docs/fy08osti/42556.pdf

Cite this

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title = "Strength of Si Wafers with Microcracks: A Theoretical Model; Preprint",

abstract = "This paper concentrates on the modeling of the strength of photovoltaic (PV) wafers. First a multimodal Weibull distribution is presented for the strength of a silicon specimen with bulk, surface, and edge imperfections. Next, a specific case is analyzed of a PV wafer with surface damage that takes the form of subsurface microcracks.",

keywords = "fracture energy theory, large-area, multimodal Weibull distribution, PV, residual microcracks, silicon wafers, wafer breakage",

author = "NREL",

year = "2008",

language = "American English",

note = "33rd IEEE Photovoltaic Specialists Conference ; Conference date: 11-05-2008 Through 16-05-2008",

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T1 - Strength of Si Wafers with Microcracks: A Theoretical Model; Preprint

AU - NREL, null

PY - 2008

Y1 - 2008

N2 - This paper concentrates on the modeling of the strength of photovoltaic (PV) wafers. First a multimodal Weibull distribution is presented for the strength of a silicon specimen with bulk, surface, and edge imperfections. Next, a specific case is analyzed of a PV wafer with surface damage that takes the form of subsurface microcracks.

AB - This paper concentrates on the modeling of the strength of photovoltaic (PV) wafers. First a multimodal Weibull distribution is presented for the strength of a silicon specimen with bulk, surface, and edge imperfections. Next, a specific case is analyzed of a PV wafer with surface damage that takes the form of subsurface microcracks.

KW - fracture energy theory

KW - large-area

KW - multimodal Weibull distribution

KW - PV

KW - residual microcracks

KW - silicon wafers

KW - wafer breakage

M3 - Paper

T2 - 33rd IEEE Photovoltaic Specialists Conference

Y2 - 11 May 2008 through 16 May 2008

ER -

Strength of Si Wafers with Microcracks: A Theoretical Model; Preprint

Abstract

Conference

NREL Publication Number

Keywords

UN SDGs

Access to Document

Fingerprint

Cite this