Stress Intensity of Delamination in a Sintered-Silver Interconnection: Preprint

Engineering

• Bonded Interface 100%
• Stress Intensity 100%
• Delamination 100%
• Power Electronics 66%
• Thermal Performance 66%
• Automotives 33%
• Baseplate 33%
• Thermal Cycle 33%
• Finite Element Modeling 33%
• Coefficient of Thermal Expansion 33%
• Material Interface 33%
• Grease 33%
• Adhesive Stress 33%
• Cohesive Stress 33%
• Heat Removal 33%
• Crack Propagation 33%
• Stress-Intensity Factor 33%
• Crack Initiation 33%
• Velocity (V) 33%
• Crack Velocity 33%
• Electronic Packaging 33%
• Degradation Rate 33%
• Phase Change Material 33%
• Heat Resistance 33%

Material Science

• Silver 100%
• Stress Intensity 100%
• Delamination 100%
• Thermal Expansion 50%
• Heat Resistance 50%
• Interface (Material) 50%
• Finite Element Modeling 50%
• Phase Change Material 50%
• Stress Intensity Factor 50%
• Crack Initiation 50%
• Crack Propagation 50%