Skip to main navigation
Skip to search
Skip to main content
National Laboratory of the Rockies Hub Home
Search content at National Laboratory of the Rockies
Hub Home
Researcher Profiles
Research Output
Research Organizations
Awards & Honors
Activities
Stress Intensity of Delamination in a Sintered-Silver Interconnection: Preprint
Douglas DeVoto
,
Paul Paret
, Andrew Wereszczak
Center for Integrated Mobility Sciences
Oak Ridge National Laboratory
Research output
:
Contribution to conference
›
Paper
Overview
Fingerprint
Fingerprint
Dive into the research topics of 'Stress Intensity of Delamination in a Sintered-Silver Interconnection: Preprint'. Together they form a unique fingerprint.
Sort by
Weight
Alphabetically
Engineering
Bonded Interface
100%
Stress Intensity
100%
Delamination
100%
Power Electronics
66%
Thermal Performance
66%
Automotives
33%
Baseplate
33%
Thermal Cycle
33%
Finite Element Modeling
33%
Coefficient of Thermal Expansion
33%
Material Interface
33%
Grease
33%
Adhesive Stress
33%
Cohesive Stress
33%
Heat Removal
33%
Crack Propagation
33%
Stress-Intensity Factor
33%
Crack Initiation
33%
Velocity (V)
33%
Crack Velocity
33%
Electronic Packaging
33%
Degradation Rate
33%
Phase Change Material
33%
Heat Resistance
33%
Material Science
Thermal Expansion
100%
Heat Resistance
100%
Interface (Material)
100%
Finite Element Modeling
100%
Phase Change Material
100%
Stress Intensity Factor
100%
Crack Initiation
100%
Crack Propagation
100%
Stress Intensity
100%
Delamination
100%