Stress Intensity of Delamination in a Sintered-Silver Interconnection

Douglas DeVoto, Paul Paret, A. Wereszczak

Research output: Contribution to conferencePaperpeer-review

3 Scopus Citations


In automotive power electronics packages, conventional thermal interface materials such as greases, gels, and phase-change materials pose bottlenecks to heat removal and are also associated with reliability concerns. The industry trend is toward high thermal performance bonded interfaces for large-area attachments. However, because of coefficient of thermal expansion mismatches between materials/layers and resultant thermomechanical stresses, adhesive and cohesive fractures could occur, posing a reliability problem. These defects manifest themselves in increased thermal resistance. This research aims to investigate and improve the thermal performance and reliability of sintered-silver for power electronics packaging applications. This has been experimentally accomplished by the synthesis of large-area bonded interfaces between metalized substrates and copper base plates that have subsequently been subjected to thermal cycles. A finite element model of crack initiation and propagation in these bonded interfaces will allow for the interpretation of degradation rates by a crack-velocity (V)- stress intensity factor (K) analysis. A description of the experiment and the modeling approach are discussed.

Original languageAmerican English
Number of pages8
StatePublished - 2014
EventIMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2014 - Albuquerque, United States
Duration: 13 May 201415 May 2014


ConferenceIMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2014
Country/TerritoryUnited States

Bibliographical note

See NREL/CP-5400-61598 for preprint

NREL Publication Number

  • NREL/CP-5400-63645


  • Bonded interfaces
  • Delamination
  • Reliability
  • Sintered-silver
  • Stress intensity


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