Abstract
In automotive power electronics packages, conventional thermal interface materials such as greases, gels, and phase-change materials pose bottlenecks to heat removal and are also associated with reliability concerns. The industry trend is toward high thermal performance bonded interfaces for large-area attachments. However, because of coefficient of thermal expansion mismatches between materials/layers and resultant thermomechanical stresses, adhesive and cohesive fractures could occur, posing a reliability problem. These defects manifest themselves in increased thermal resistance. This research aims to investigate and improve the thermal performance and reliability of sintered-silver for power electronics packaging applications. This has been experimentally accomplished by the synthesis of large-area bonded interfaces between metalized substrates and copper base plates that have subsequently been subjected to thermal cycles. A finite element model of crack initiation and propagation in these bonded interfaces will allow for the interpretation of degradation rates by a crack-velocity (V)- stress intensity factor (K) analysis. A description of the experiment and the modeling approach are discussed.
Original language | American English |
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Pages | 296-303 |
Number of pages | 8 |
State | Published - 2014 |
Event | IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2014 - Albuquerque, United States Duration: 13 May 2014 → 15 May 2014 |
Conference
Conference | IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2014 |
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Country/Territory | United States |
City | Albuquerque |
Period | 13/05/14 → 15/05/14 |
Bibliographical note
See NREL/CP-5400-61598 for preprintNREL Publication Number
- NREL/CP-5400-63645
Keywords
- Bonded interfaces
- Delamination
- Reliability
- Sintered-silver
- Stress intensity