Surface Damage Introduced by Diamond Wire Sawing of Si Wafers: Measuring In-Depth and the Lateral Distributions for Different Cutting Parameters

Santosh Sahoo; Kaitlyn VanSant; Rekha Schnepf; James Gee; Ferdinando Severico; Hubert Seigneur; Winston Schoenfeld; Steve Preece; Jeff Binns; Jesse Appel

doi:10.1557/opl.2015.830

Surface Damage Introduced by Diamond Wire Sawing of Si Wafers: Measuring In-Depth and the Lateral Distributions for Different Cutting Parameters

Santosh Sahoo, Kaitlyn VanSant, Rekha Schnepf, James Gee, Ferdinando Severico, Hubert Seigneur, Winston Schoenfeld, Steve Preece, Jeff Binns, Jesse Appel

Materials Science

Research output: Contribution to conference › Paper

Original language	American English
Number of pages	6
DOIs	https://doi.org/10.1557/opl.2015.830
State	Published - 2015
Event	Materials Research Society Spring Meeting - San Francisco, California Duration: 6 Apr 2015 → 10 Apr 2015

Conference

Conference	Materials Research Society Spring Meeting
City	San Francisco, California
Period	6/04/15 → 10/04/15

NREL Publication Number

NREL/CP-5J00-64201

Keywords

damage
dislocations
fracture
lifetime
photovoltaic
silicon

Access to Document

10.1557/opl.2015.830

Cite this

Sahoo, S., VanSant, K., Schnepf, R., Gee, J., Severico, F., Seigneur, H., Schoenfeld, W., Preece, S., Binns, J., & Appel, J. (2015). Surface Damage Introduced by Diamond Wire Sawing of Si Wafers: Measuring In-Depth and the Lateral Distributions for Different Cutting Parameters. Paper presented at Materials Research Society Spring Meeting, San Francisco, California. https://doi.org/10.1557/opl.2015.830

@conference{876c0c5ed1754ac29f22b8736247ee8c,

title = "Surface Damage Introduced by Diamond Wire Sawing of Si Wafers: Measuring In-Depth and the Lateral Distributions for Different Cutting Parameters",

keywords = "damage, dislocations, fracture, lifetime, photovoltaic, silicon",

author = "Santosh Sahoo and Kaitlyn VanSant and Rekha Schnepf and James Gee and Ferdinando Severico and Hubert Seigneur and Winston Schoenfeld and Steve Preece and Jeff Binns and Jesse Appel",

year = "2015",

doi = "10.1557/opl.2015.830",

language = "American English",

note = "Materials Research Society Spring Meeting ; Conference date: 06-04-2015 Through 10-04-2015",

}

Sahoo, S, VanSant, K, Schnepf, R, Gee, J, Severico, F, Seigneur, H, Schoenfeld, W, Preece, S, Binns, J & Appel, J 2015, 'Surface Damage Introduced by Diamond Wire Sawing of Si Wafers: Measuring In-Depth and the Lateral Distributions for Different Cutting Parameters', Paper presented at Materials Research Society Spring Meeting, San Francisco, California, 6/04/15 - 10/04/15. https://doi.org/10.1557/opl.2015.830

TY - CONF

T1 - Surface Damage Introduced by Diamond Wire Sawing of Si Wafers: Measuring In-Depth and the Lateral Distributions for Different Cutting Parameters

AU - Sahoo, Santosh

AU - VanSant, Kaitlyn

AU - Schnepf, Rekha

AU - Gee, James

AU - Severico, Ferdinando

AU - Seigneur, Hubert

AU - Schoenfeld, Winston

AU - Preece, Steve

AU - Binns, Jeff

AU - Appel, Jesse

PY - 2015

Y1 - 2015

KW - damage

KW - dislocations

KW - fracture

KW - lifetime

KW - photovoltaic

KW - silicon

U2 - 10.1557/opl.2015.830

DO - 10.1557/opl.2015.830

M3 - Paper

T2 - Materials Research Society Spring Meeting

Y2 - 6 April 2015 through 10 April 2015

ER -