Surface Damage Introduced by Diamond Wire Sawing of Si Wafers: Measuring In-Depth and the Lateral Distributions for Different Cutting Parameters

Santosh Sahoo, Kaitlyn VanSant, Rekha Schnepf, James Gee, Ferdinando Severico, Hubert Seigneur, Winston Schoenfeld, Steve Preece, Jeff Binns, Jesse Appel

Research output: Contribution to conferencePaper

Original languageAmerican English
Number of pages6
StatePublished - 2015
EventMaterials Research Society Spring Meeting - San Francisco, California
Duration: 6 Apr 201510 Apr 2015


ConferenceMaterials Research Society Spring Meeting
CitySan Francisco, California

NREL Publication Number

  • NREL/CP-5J00-64201


  • damage
  • dislocations
  • fracture
  • lifetime
  • photovoltaic
  • silicon

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