Surface Damage Introduced by Diamond Wire Sawing of Si Wafers: Measuring In-Depth and the Lateral Distributions for Different Cutting Parameters

Santosh Sahoo; Kaitlyn VanSant; Rekha Schnepf; James Gee; Ferdinando Severico; Hubert Seigneur; Winston Schoenfeld; Steve Preece; Jeff Binns; Jesse Appel

doi:10.1557/opl.2015.830

Surface Damage Introduced by Diamond Wire Sawing of Si Wafers: Measuring In-Depth and the Lateral Distributions for Different Cutting Parameters

Santosh Sahoo
, Kaitlyn VanSant
, Rekha Schnepf
, James Gee
, Ferdinando Severico
, Hubert Seigneur
, Winston Schoenfeld
, Steve Preece
, Jeff Binns
, Jesse Appel

Materials Science

Research output: Contribution to conference › Paper

Original language	American English
Number of pages	6
DOIs	https://doi.org/10.1557/opl.2015.830
State	Published - 2015
Event	Materials Research Society Spring Meeting - San Francisco, California Duration: 6 Apr 2015 → 10 Apr 2015

Conference

Conference	Materials Research Society Spring Meeting
City	San Francisco, California
Period	6/04/15 → 10/04/15

NLR Publication Number

NREL/CP-5J00-64201

Keywords

damage
dislocations
fracture
lifetime
photovoltaic
silicon

Access to Document

10.1557/opl.2015.830

Cite this

Sahoo, S., VanSant, K., Schnepf, R., Gee, J., Severico, F., Seigneur, H., Schoenfeld, W., Preece, S., Binns, J., & Appel, J. (2015). Surface Damage Introduced by Diamond Wire Sawing of Si Wafers: Measuring In-Depth and the Lateral Distributions for Different Cutting Parameters. Paper presented at Materials Research Society Spring Meeting, San Francisco, California. https://doi.org/10.1557/opl.2015.830

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title = "Surface Damage Introduced by Diamond Wire Sawing of Si Wafers: Measuring In-Depth and the Lateral Distributions for Different Cutting Parameters",

keywords = "damage, dislocations, fracture, lifetime, photovoltaic, silicon",

author = "Santosh Sahoo and Kaitlyn VanSant and Rekha Schnepf and James Gee and Ferdinando Severico and Hubert Seigneur and Winston Schoenfeld and Steve Preece and Jeff Binns and Jesse Appel",

year = "2015",

doi = "10.1557/opl.2015.830",

language = "American English",

note = "Materials Research Society Spring Meeting ; Conference date: 06-04-2015 Through 10-04-2015",

}

Sahoo, S, VanSant, K, Schnepf, R, Gee, J, Severico, F, Seigneur, H, Schoenfeld, W, Preece, S, Binns, J & Appel, J 2015, 'Surface Damage Introduced by Diamond Wire Sawing of Si Wafers: Measuring In-Depth and the Lateral Distributions for Different Cutting Parameters', Paper presented at Materials Research Society Spring Meeting, San Francisco, California, 6/04/15 - 10/04/15. https://doi.org/10.1557/opl.2015.830

TY - CONF

T1 - Surface Damage Introduced by Diamond Wire Sawing of Si Wafers: Measuring In-Depth and the Lateral Distributions for Different Cutting Parameters

AU - Sahoo, Santosh

AU - VanSant, Kaitlyn

AU - Schnepf, Rekha

AU - Gee, James

AU - Severico, Ferdinando

AU - Seigneur, Hubert

AU - Schoenfeld, Winston

AU - Preece, Steve

AU - Binns, Jeff

AU - Appel, Jesse

PY - 2015

Y1 - 2015

KW - damage

KW - dislocations

KW - fracture

KW - lifetime

KW - photovoltaic

KW - silicon

U2 - 10.1557/opl.2015.830

DO - 10.1557/opl.2015.830

M3 - Paper

T2 - Materials Research Society Spring Meeting

Y2 - 6 April 2015 through 10 April 2015

ER -