TY - JOUR
T1 - Techno-Economic Feasibility Analysis of an Extreme Heat Flux Micro-Cooler
AU - Dede, Ercan
AU - Zhang, Chi
AU - Wu, Qianying
AU - Seyedhassantehrani, Neda
AU - Shattique, Muhammad
AU - Roy, Souvik
AU - Palko, James
AU - Narumanchi, Sreekant
AU - Kekelia, Bidzina
AU - Hazra, Sougata
AU - Goodson, Kenneth
AU - Giglio, Roman
AU - Asheghi, Mehdi
N1 - Publisher Copyright:
© 2022 The Authors
PY - 2023/1/20
Y1 - 2023/1/20
N2 - An estimated 70% of the electricity in the United States currently passes through power conversion electronics, and this percentage is projected to increase eventually to up to 100%. At a global scale, wide adoption of highly efficient power electronics technologies is thus anticipated to have a major impact on worldwide energy consumption. As described in this perspective, for power conversion, outstanding thermal management for semiconductor devices is one key to unlocking this potentially massive energy savings. Integrated microscale cooling has been positively identified for such thermal management of future high-heat-flux, i.e., 1 kW/cm2, wide-bandgap (WBG) semiconductor devices. In this work, we connect this advanced cooling approach to the energy impact of using WBG devices and further present a techno-economic analysis to clarify the projected status of performance, manufacturing approaches, fabrication costs, and remaining barriers to the adoption of such cooling technology.
AB - An estimated 70% of the electricity in the United States currently passes through power conversion electronics, and this percentage is projected to increase eventually to up to 100%. At a global scale, wide adoption of highly efficient power electronics technologies is thus anticipated to have a major impact on worldwide energy consumption. As described in this perspective, for power conversion, outstanding thermal management for semiconductor devices is one key to unlocking this potentially massive energy savings. Integrated microscale cooling has been positively identified for such thermal management of future high-heat-flux, i.e., 1 kW/cm2, wide-bandgap (WBG) semiconductor devices. In this work, we connect this advanced cooling approach to the energy impact of using WBG devices and further present a techno-economic analysis to clarify the projected status of performance, manufacturing approaches, fabrication costs, and remaining barriers to the adoption of such cooling technology.
KW - advanced packaging
KW - microcooler
KW - power electronics
KW - techno-economic analysis
KW - thermal management
UR - http://www.scopus.com/inward/record.url?scp=85145289543&partnerID=8YFLogxK
U2 - 10.1016/j.isci.2022.105812
DO - 10.1016/j.isci.2022.105812
M3 - Article
AN - SCOPUS:85145289543
SN - 2589-0042
VL - 26
JO - iScience
JF - iScience
IS - 1
M1 - Article No. 105812
ER -