Abstract
A number of candidate alternative encapsulant and soft backsheet materials have been evaluated in terms of their suitability for photovoltaic (PV) module packaging applications. Relevant properties, including interfacial adhesion and moisture transport, have been measured as a function of damp-heat (85?C / 85% relative humidity) exposure. Based on these tests, promising new encapsulants withimproved properties have been identified. Backsheets prepared by industry and at NREL have been found to provide varying levels of moisture ingress protection. To achieve significantly improved products, further development of these candidates is ongoing. The relative effectiveness of various packaging strategies to protect PV devices has also been investigated.
| Original language | American English |
|---|---|
| Number of pages | 7 |
| State | Published - 2005 |
| Event | 31st IEEE Photovoltaics Specialists Conference and Exhibition - Lake Buena Vista, Florida Duration: 3 Jan 2005 → 7 Jan 2005 |
Conference
| Conference | 31st IEEE Photovoltaics Specialists Conference and Exhibition |
|---|---|
| City | Lake Buena Vista, Florida |
| Period | 3/01/05 → 7/01/05 |
NREL Publication Number
- NREL/CP-520-37366
Keywords
- encapsulant
- module reliability
- moisture ingress protection
- packaging applications
- PV
- soft backsheet materials