Testing of Packaging Materials for Improved PV Module Reliability

G. J. Jorgensen, K. M. Terwilliger, M. D. Kempe, T. J. McMahon

Research output: Contribution to conferencePaperpeer-review

9 Scopus Citations

Abstract

A number of candidate alternative encapsulant and soft backsheet materials have been evaluated in terms of their suitability for photovoltaic (PV) module packaging applications. Relevant properties, including interfacial adhesion and moisture transport, have been measured as a function of damp-heat (85°C / 85% relative humidity) exposure. Based on these tests, promising new encapsulants with improved properties have been identified. Backsheets prepared by industry and at NREL have been found to provide varying levels of moisture ingress protection. To achieve significantly improved products, further development of these candidates is ongoing. The relative effectiveness of various packaging strategies to protect PV devices has also been investigated.

Original languageAmerican English
Pages499-502
Number of pages4
StatePublished - 2005
Event31st IEEE Photovoltaic Specialists Conference - 2005 - Lake Buena Vista, FL, United States
Duration: 3 Jan 20057 Jan 2005

Conference

Conference31st IEEE Photovoltaic Specialists Conference - 2005
Country/TerritoryUnited States
CityLake Buena Vista, FL
Period3/01/057/01/05

Bibliographical note

For preprint version see NREL/CP-520-37366

NREL Publication Number

  • NREL/CP-520-38882

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