Testing of Packaging Materials for Improved PV Module Reliability

G. J. Jorgensen; K. M. Terwilliger; M. D. Kempe; T. J. McMahon

Testing of Packaging Materials for Improved PV Module Reliability

G. J. Jorgensen, K. M. Terwilliger, M. D. Kempe, T. J. McMahon

Materials Science

National Renewable Energy Laboratory

Research output: Contribution to conference › Paper › peer-review

10 Scopus Citations

Abstract

A number of candidate alternative encapsulant and soft backsheet materials have been evaluated in terms of their suitability for photovoltaic (PV) module packaging applications. Relevant properties, including interfacial adhesion and moisture transport, have been measured as a function of damp-heat (85°C / 85% relative humidity) exposure. Based on these tests, promising new encapsulants with improved properties have been identified. Backsheets prepared by industry and at NREL have been found to provide varying levels of moisture ingress protection. To achieve significantly improved products, further development of these candidates is ongoing. The relative effectiveness of various packaging strategies to protect PV devices has also been investigated.

Original language	American English
Pages	499-502
Number of pages	4
State	Published - 2005
Event	31st IEEE Photovoltaic Specialists Conference - 2005 - Lake Buena Vista, FL, United States Duration: 3 Jan 2005 → 7 Jan 2005

Conference

Conference	31st IEEE Photovoltaic Specialists Conference - 2005
Country/Territory	United States
City	Lake Buena Vista, FL
Period	3/01/05 → 7/01/05

Bibliographical note

For preprint version see NREL/CP-520-37366

NREL Publication Number

NREL/CP-520-38882

Cite this

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title = "Testing of Packaging Materials for Improved PV Module Reliability",

abstract = "A number of candidate alternative encapsulant and soft backsheet materials have been evaluated in terms of their suitability for photovoltaic (PV) module packaging applications. Relevant properties, including interfacial adhesion and moisture transport, have been measured as a function of damp-heat (85°C / 85\% relative humidity) exposure. Based on these tests, promising new encapsulants with improved properties have been identified. Backsheets prepared by industry and at NREL have been found to provide varying levels of moisture ingress protection. To achieve significantly improved products, further development of these candidates is ongoing. The relative effectiveness of various packaging strategies to protect PV devices has also been investigated.",

author = "Jorgensen, \{G. J.\} and Terwilliger, \{K. M.\} and Kempe, \{M. D.\} and McMahon, \{T. J.\}",

note = "For preprint version see NREL/CP-520-37366; 31st IEEE Photovoltaic Specialists Conference - 2005 ; Conference date: 03-01-2005 Through 07-01-2005",

year = "2005",

language = "American English",

pages = "499--502",

}

TY - CONF

T1 - Testing of Packaging Materials for Improved PV Module Reliability

AU - Jorgensen, G. J.

AU - Terwilliger, K. M.

AU - Kempe, M. D.

AU - McMahon, T. J.

N1 - For preprint version see NREL/CP-520-37366

PY - 2005

Y1 - 2005

N2 - A number of candidate alternative encapsulant and soft backsheet materials have been evaluated in terms of their suitability for photovoltaic (PV) module packaging applications. Relevant properties, including interfacial adhesion and moisture transport, have been measured as a function of damp-heat (85°C / 85% relative humidity) exposure. Based on these tests, promising new encapsulants with improved properties have been identified. Backsheets prepared by industry and at NREL have been found to provide varying levels of moisture ingress protection. To achieve significantly improved products, further development of these candidates is ongoing. The relative effectiveness of various packaging strategies to protect PV devices has also been investigated.

AB - A number of candidate alternative encapsulant and soft backsheet materials have been evaluated in terms of their suitability for photovoltaic (PV) module packaging applications. Relevant properties, including interfacial adhesion and moisture transport, have been measured as a function of damp-heat (85°C / 85% relative humidity) exposure. Based on these tests, promising new encapsulants with improved properties have been identified. Backsheets prepared by industry and at NREL have been found to provide varying levels of moisture ingress protection. To achieve significantly improved products, further development of these candidates is ongoing. The relative effectiveness of various packaging strategies to protect PV devices has also been investigated.

UR - https://www.scopus.com/pages/publications/27944453182

M3 - Paper

AN - SCOPUS:27944453182

SP - 499

EP - 502

T2 - 31st IEEE Photovoltaic Specialists Conference - 2005

Y2 - 3 January 2005 through 7 January 2005

ER -

Testing of Packaging Materials for Improved PV Module Reliability

Abstract

Conference

Bibliographical note

NREL Publication Number

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Cite this