Thermal Management of Wide-Bandgap Semiconductor Amplifiers Used for Plasma Heating and Control

Sangeeta Vinoth, Xuhui Feng, Christopher Galea, Gilbert Moreno, Michael Paluszek, Sreekant Narumanchi

Research output: Contribution to conferencePaper

Abstract

Princeton Fusion Systems (PFS) has designed, built, and tested a Load Switch printed circuit board (PCB) to demonstrate the capabilities of 2 kV silicon carbide (SiC) cascodes in development by Qorvo towards plasma heating and control applications. Initial tests have been conducted at low power (~100 W) for validation with thermal finite element analysis (FEA) modeling performed by the National Renewable Energy Laboratory (NREL). Comparisons of experimental data with the thermal modeling results, along with considerations for operating in plasma systems, will be discussed.
Original languageAmerican English
Pages62-66
Number of pages5
StatePublished - 2024
EventSemi-Therm Symposium - San Jose, CA
Duration: 25 Mar 202429 Mar 2024

Conference

ConferenceSemi-Therm Symposium
CitySan Jose, CA
Period25/03/2429/03/24

NREL Publication Number

  • NREL/CP-5400-88703

Keywords

  • control systems
  • cooling
  • plasmas
  • printed circuits
  • silicon carbide
  • switches
  • thermal management

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