Thermal Performance and Reliability Characterization of Bonded Interface Materials (BIMs)

Douglas Devoto; Paul Paret; Mark Mihalic; Sreekant Narumanchi; Avram Bar-Cohen; Kaiser Matin

doi:10.1109/ITHERM.2014.6892310

Thermal Performance and Reliability Characterization of Bonded Interface Materials (BIMs)

Douglas Devoto, Paul Paret, Mark Mihalic, Sreekant Narumanchi, Avram Bar-Cohen, Kaiser Matin

Center for Integrated Mobility Sciences

Research output: Contribution to conference › Paper › peer-review

10 Scopus Citations

Abstract

Thermal interface materials (TIMs) are an important enabler for low thermal resistance and reliable electronics packaging for a wide array of applications. There is a trend towards bonded interface materials (BIMs) because of their potential for low thermal resistance (<1 mm²-K/W). However, due to coefficient of thermal expansion mismatches between various layers of a package, thermomechanical stresses are induced in BIMs and the package can be prone to failures and integrity risks. Deteriorated interfaces can result in high thermal resistance in the package and degradation and/or failure of the electronics. The Defense Advanced Research Projects Agency's (DARPA) Thermal Management Technologies (TMT) Program has addressed this challenge, supporting the development of mechanically compliant, low resistivity nano-thermal interface (NTI) materials. Prior development of these materials resulted in samples that met DARPA's initial thermal performance and synthesis metrics. In this present work, we describe the testing procedure and report the results of thermal performance and reliability characterization of an initial sample set of three different NTI-BIMs tested at the National Renewable Energy Laboratory.

Original language	American English
Pages	409-417
Number of pages	9
DOIs	https://doi.org/10.1109/ITHERM.2014.6892310 https://doi.org/10.1109/ITHERM.2014.6892310
State	Published - 4 Sep 2014
Event	14th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2014 - Orlando, United States Duration: 27 May 2014 → 30 May 2014

Conference

Conference	14th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2014
Country/Territory	United States
City	Orlando
Period	27/05/14 → 30/05/14

Bibliographical note

See NREL/CP-5400-61107 for preprint

NREL Publication Number

NREL/CP-5400-63023

Keywords

accelerated testing
aging
bonded interface material
steady-state technique
temperature cycling
thermal interface
thermal resistance
transient technique

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

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Devoto, D., Paret, P., Mihalic, M., Narumanchi, S., Bar-Cohen, A., & Matin, K. (2014). Thermal Performance and Reliability Characterization of Bonded Interface Materials (BIMs). 409-417. Paper presented at 14th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2014, Orlando, United States. https://doi.org/10.1109/ITHERM.2014.6892310, https://doi.org/10.1109/ITHERM.2014.6892310

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author = "Douglas Devoto and Paul Paret and Mark Mihalic and Sreekant Narumanchi and Avram Bar-Cohen and Kaiser Matin",

note = "See NREL/CP-5400-61107 for preprint; 14th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2014 ; Conference date: 27-05-2014 Through 30-05-2014",

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Devoto, D , Paret, P, Mihalic, M, Narumanchi, S, Bar-Cohen, A & Matin, K 2014, 'Thermal Performance and Reliability Characterization of Bonded Interface Materials (BIMs)', Paper presented at 14th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2014, Orlando, United States, 27/05/14 - 30/05/14 pp. 409-417. https://doi.org/10.1109/ITHERM.2014.6892310, https://doi.org/10.1109/ITHERM.2014.6892310

Thermal Performance and Reliability Characterization of Bonded Interface Materials (BIMs). / Devoto, Douglas ; Paret, Paul; Mihalic, Mark et al.
2014. 409-417 Paper presented at 14th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2014, Orlando, United States.

Research output: Contribution to conference › Paper › peer-review

TY - CONF

T1 - Thermal Performance and Reliability Characterization of Bonded Interface Materials (BIMs)

AU - Devoto, Douglas

AU - Paret, Paul

AU - Mihalic, Mark

AU - Narumanchi, Sreekant

AU - Bar-Cohen, Avram

AU - Matin, Kaiser

N1 - See NREL/CP-5400-61107 for preprint

PY - 2014/9/4

Y1 - 2014/9/4

N2 - Thermal interface materials (TIMs) are an important enabler for low thermal resistance and reliable electronics packaging for a wide array of applications. There is a trend towards bonded interface materials (BIMs) because of their potential for low thermal resistance (<1 mm2-K/W). However, due to coefficient of thermal expansion mismatches between various layers of a package, thermomechanical stresses are induced in BIMs and the package can be prone to failures and integrity risks. Deteriorated interfaces can result in high thermal resistance in the package and degradation and/or failure of the electronics. The Defense Advanced Research Projects Agency's (DARPA) Thermal Management Technologies (TMT) Program has addressed this challenge, supporting the development of mechanically compliant, low resistivity nano-thermal interface (NTI) materials. Prior development of these materials resulted in samples that met DARPA's initial thermal performance and synthesis metrics. In this present work, we describe the testing procedure and report the results of thermal performance and reliability characterization of an initial sample set of three different NTI-BIMs tested at the National Renewable Energy Laboratory.

AB - Thermal interface materials (TIMs) are an important enabler for low thermal resistance and reliable electronics packaging for a wide array of applications. There is a trend towards bonded interface materials (BIMs) because of their potential for low thermal resistance (<1 mm2-K/W). However, due to coefficient of thermal expansion mismatches between various layers of a package, thermomechanical stresses are induced in BIMs and the package can be prone to failures and integrity risks. Deteriorated interfaces can result in high thermal resistance in the package and degradation and/or failure of the electronics. The Defense Advanced Research Projects Agency's (DARPA) Thermal Management Technologies (TMT) Program has addressed this challenge, supporting the development of mechanically compliant, low resistivity nano-thermal interface (NTI) materials. Prior development of these materials resulted in samples that met DARPA's initial thermal performance and synthesis metrics. In this present work, we describe the testing procedure and report the results of thermal performance and reliability characterization of an initial sample set of three different NTI-BIMs tested at the National Renewable Energy Laboratory.

KW - accelerated testing

KW - aging

KW - bonded interface material

KW - steady-state technique

KW - temperature cycling

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KW - thermal resistance

KW - transient technique

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T2 - 14th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2014

Y2 - 27 May 2014 through 30 May 2014

ER -

Devoto D , Paret P, Mihalic M, Narumanchi S, Bar-Cohen A, Matin K. Thermal Performance and Reliability Characterization of Bonded Interface Materials (BIMs). 2014. Paper presented at 14th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2014, Orlando, United States. doi: 10.1109/ITHERM.2014.6892310, 10.1109/ITHERM.2014.6892310

Thermal Performance and Reliability Characterization of Bonded Interface Materials (BIMs)

Abstract

Conference

Bibliographical note

NREL Publication Number

Keywords

UN SDGs

Access to Document

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