Thermal Performance and Reliability Characterization of Bonded Interface Materials (BIMs): Preprint

Douglas DeVoto, Paul Paret, Sreekant Narumanchi, Avram Bar-Cohen, Kaiser Matin

Research output: Contribution to conferencePaper


Thermal interface materials are an important enabler for low thermal resistance and reliable electronics packaging for a wide array of applications. There is a trend towards bonded interface materials (BIMs) because of their potential for low thermal resistivity (< 1 mm2K/W). However, BIMs induce thermomechanical stresses in the package and can be prone to failures and integrity risks.Deteriorated interfaces can result in high thermal resistance in the package and degradation and/or failure of the electronics. DARPA's Thermal Management Technologies program has addressed this challenge, supporting the development of mechanically-compliant, low resistivity nano-thermal interface (NTI) materials. In this work, we describe the testing procedure and report the results of NREL's thermal performance and reliability characterization of an initial sample of four different NTI-BIMs.
Original languageAmerican English
Number of pages11
StatePublished - 2014
EventITherm 2014 - Orlando, Florida
Duration: 27 May 201430 May 2014


ConferenceITherm 2014
CityOrlando, Florida

NREL Publication Number

  • NREL/CP-5400-61107


  • accelerated testing
  • bonded interface material
  • thermal interface
  • thermal resistance


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