@misc{e0f830ff38264c45afd93352d7fbf076,
title = "Thermal Performance and Reliability of Bonded Interfaces for Power Electronics Packaging Applications (Presentation): NREL (National Renewable Energy Laboratory)",
abstract = "This presentation discusses the thermal performance and reliability of bonded interfaces for power electronics packaging applications.",
keywords = "bonded interfaces, electronics packaging applications, power electronics, thermal performance",
author = "Douglas DeVoto",
year = "2013",
language = "American English",
series = "Presented at the 2011 Workshop on Accelerated Stress Testing & Reliability, 28-30 September 2011, San Francisco, California",
type = "Other",
}
