Thermomechanical Modeling of Sintered Silver - A Fracture Mechanics-based Approach: Extended Abstract: Preprint

Sintered silver has proven to be a promising candidate for use as a die-attach and substrate-attach material in automotive power electronics components. It holds promise of greater reliability than lead-based and lead-free solders, especially at higher temperatures (less than 200 degrees Celcius). Accurate predictive lifetime models of sintered silver need to be developed and its failure mechanisms thoroughly characterized before it can be deployed as a die-attach or substrate-attach material in wide-bandgap device-based packages. We present a finite element method (FEM) modeling methodology that can offer greater accuracy in predicting the failure of sintered silver under accelerated thermal cycling. A fracture mechanics-based approach is adopted in the FEM model, and J-integral/thermal cycle values are computed. In this paper, we outline the procedures for obtaining the J-integral/thermal cycle values in a computational model and report on the possible advantage of using these values as modeling parameters in a predictive lifetime model.