@misc{7c2221e1c0f24ead9c927e065a70ff25,
title = "Thermomechanical Reliability Aspects of Automotive Power Electronics: Current Status and Future Trends",
abstract = "Common failure locations (e.g., wire bonds, solder interface) and mechanisms within traditional automotive power electronics package designs and reliability concerns associated with packaging at higher temperatures and higher heat fluxes will be discussed. Examples of packaging solutions that increase mechanical reliability will be presented and state-of-health (SOH) estimation using offline and online (in situ) techniques will be described.",
keywords = "packaging, power electronics, reliability, substrates",
author = "Douglas DeVoto",
year = "2023",
language = "American English",
series = "Presented at the 2023 IEEE Applied Power Electronics Conference (APEC), 19-23 March 2023, Orlando, Florida",
type = "Other",
}