Thermomechanical Reliability Aspects of Automotive Power Electronics: Current Status and Future Trends

Research output: NRELPresentation

Abstract

Common failure locations (e.g., wire bonds, solder interface) and mechanisms within traditional automotive power electronics package designs and reliability concerns associated with packaging at higher temperatures and higher heat fluxes will be discussed. Examples of packaging solutions that increase mechanical reliability will be presented and state-of-health (SOH) estimation using offline and online (in situ) techniques will be described.
Original languageAmerican English
Number of pages21
StatePublished - 2023

Publication series

NamePresented at the 2023 IEEE Applied Power Electronics Conference (APEC), 19-23 March 2023, Orlando, Florida

NREL Publication Number

  • NREL/PR-5400-85209

Keywords

  • packaging
  • power electronics
  • reliability
  • substrates

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