Thickness Mapping Using Multispectral Imaging

Przemyslaw Koralewicz (Inventor), Michael Ulsh (Inventor)

Research output: Patent


An example system includes a material transport system configured to transport a substantially planar material through a monitoring zone, an illumination source configured to illuminate at least a portion of the material that is within the monitoring zone with light, and a sensor configured to obtain a plurality of consecutive datasets. Datasets indicate, for locations of the material and for a specific wavelength of light, a respective intensity of the light that is of the wavelength and that is received from the location. The system also includes a processing system configured to receive the dataset, determine, based on the dataset and for each of at least two locations in the plurality of locations, a respective value of a thickness of the material, and execute, based on the respective value of the thickness of the material for at least one of the at least two locations, an action.
Original languageAmerican English
Patent number10,480,935 B2
Filing date19/11/19
StatePublished - 2019

NREL Publication Number

  • NREL/PT-5000-75498


  • full area
  • high resolution
  • multispectral imaging
  • thickness mapping
  • two-dimensional inspection


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