Abstract
Mobil Solar Energy Corp. investigated manufacturing crystalline silicon wafers using the edge-defined film-fed growth (EFG) technique. This report identifies the following: (1) current capabilities for manufacturing 200-micron-thick crystalline silicon wafers (10 cm {times} 10 cm) produced by growing octagons using the EFG technique and laser cutting them into wafers; (2) potential manufacturingimprovements from decreasing the thickness of the wafers, improving the quality of the laser cut edge, and increasing cutting speed, all of which lead to reduce manufacturing costs, improved performance, and increased production capacities; (3) problems that impede achieving these potentials; and (4) costs and other requirements involved in overcoming the problems.
Original language | American English |
---|---|
Number of pages | 17 |
State | Published - 1992 |
Bibliographical note
Work performed by Mobil Solar Energy Corporation, Billerica, MassachusettsNREL Publication Number
- NREL/SR-214-4484