Tunneling or Pinholes: Understanding the Transport Mechanisms in SiOxBased Passivated Contacts for High-Efficiency Silicon Solar Cells

Research output: Contribution to conferencePaperpeer-review

15 Scopus Citations

Abstract

We have compared the temperature dependence of the poly-Si/SiO x /c-Si contact performance for 1.5 and 2.2 nm thick SiO x . The optimum annealing temperature for these two is different, likely due to the SiO x influencing the extent of dopant diffusion into c-Si. At 1050° C, while a contact with 1.5 nm SiO x significantly breaks up, the one with 2.2 nm SiO x develops pinholes. Using scanning Kelvin probe microscopy, we demonstrate that there is enhanced dopant diffusion through these pinholes. Finally, using electron-beam induced current measurements, we show that pinholes affect the local passivation quality of the c-Si wafer surface.

Original languageAmerican English
Pages3473-3476
Number of pages4
DOIs
StatePublished - 26 Nov 2018
Event7th IEEE World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - Waikoloa Village, United States
Duration: 10 Jun 201815 Jun 2018

Conference

Conference7th IEEE World Conference on Photovoltaic Energy Conversion, WCPEC 2018
Country/TerritoryUnited States
CityWaikoloa Village
Period10/06/1815/06/18

Bibliographical note

Publisher Copyright:
© 2018 IEEE.

NREL Publication Number

  • NREL/CP-5900-71567

Keywords

  • electron-beam induced current
  • kelvin probe microscopy
  • passivated contact
  • silicon oxide
  • silicon solar cell

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