Abstract
We have compared the temperature dependence of the poly-Si/SiO x /c-Si contact performance for 1.5 and 2.2 nm thick SiO x . The optimum annealing temperature for these two is different, likely due to the SiO x influencing the extent of dopant diffusion into c-Si. At 1050° C, while a contact with 1.5 nm SiO x significantly breaks up, the one with 2.2 nm SiO x develops pinholes. Using scanning Kelvin probe microscopy, we demonstrate that there is enhanced dopant diffusion through these pinholes. Finally, using electron-beam induced current measurements, we show that pinholes affect the local passivation quality of the c-Si wafer surface.
Original language | American English |
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Pages | 3473-3476 |
Number of pages | 4 |
DOIs | |
State | Published - 26 Nov 2018 |
Event | 7th IEEE World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - Waikoloa Village, United States Duration: 10 Jun 2018 → 15 Jun 2018 |
Conference
Conference | 7th IEEE World Conference on Photovoltaic Energy Conversion, WCPEC 2018 |
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Country/Territory | United States |
City | Waikoloa Village |
Period | 10/06/18 → 15/06/18 |
Bibliographical note
Publisher Copyright:© 2018 IEEE.
NREL Publication Number
- NREL/CP-5900-71567
Keywords
- electron-beam induced current
- kelvin probe microscopy
- passivated contact
- silicon oxide
- silicon solar cell