Abstract
As part of the U.S. Department of Energy (DOE) Advanced Power Electronics (APE) program, DOE's National Renewable Energy Laboratory (NREL) is currently leading a national effort to develop next-generation cooling technologies for hybrid vehicle electronics. Spray cooling has been identified as a potential solution that can dissipate 150-200 W/cm2 while maintaining the chip temperature below 125°C. This study explores the viability and implementation of this cooling scheme. First, commercial coolants are assessed for their suitability to this application in terms of thermal, environmental, and safety concerns and material compatibility. In this assessment, HFE-7100 is identified as the optimum coolant in all performance categories. Next, spray models are used to determine the HFE-7100 spray conditions that meet such stringent heat dissipation requirements. These findings are verified experimentally, demonstrating that spray cooling is a viable thermal management solution for hybrid vehicle electronics.
Original language | American English |
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Pages | 1210-1221 |
Number of pages | 12 |
DOIs | |
State | Published - 2008 |
Event | 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM - Orlando,FL, United States Duration: 28 May 2008 → 31 May 2008 |
Conference
Conference | 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM |
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Country/Territory | United States |
City | Orlando,FL |
Period | 28/05/08 → 31/05/08 |
Bibliographical note
For preprint version see NREL/CP-540-42389NREL Publication Number
- NREL/CP-540-44057
Keywords
- Electronics cooling
- Environmental
- Hybrid vehicles
- Power electronics
- Spray cooling