Abstract
Tessolar module technology was developed to allow the incorporation of 5 incremental module material innovations. Combined, these innovations may improve the efficiency and durability of the standard silicon cell module. The innovations evaluated are: electrically conductive adhesive (ECA) replacing soldering of tabbing ribbons, light-capturing ribbon (LCR), silicone encapsulant, 2 mm front glass with backsheet, and a polymer-composite module frame. Tessolarconstructed individually encapsulated cells incorporating the material innovations are used to assemble 60-cell modules. 2x2 cell mini-modules of the same materials were produced for combined-accelerated stress testing (C-AST). C-AST results demonstrate that the 2x2 cell mini-module of Tessolar construction out-performed mini-modules using both ECA with EVA and standard solder with EVA constructions in power production over 108 cycles of testing.
Original language | American English |
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Pages | 2243-2248 |
Number of pages | 6 |
DOIs | |
State | Published - Jun 2019 |
Event | 46th IEEE Photovoltaic Specialists Conference, PVSC 2019 - Chicago, United States Duration: 16 Jun 2019 → 21 Jun 2019 |
Conference
Conference | 46th IEEE Photovoltaic Specialists Conference, PVSC 2019 |
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Country/Territory | United States |
City | Chicago |
Period | 16/06/19 → 21/06/19 |
Bibliographical note
Publisher Copyright:© 2019 IEEE.
NREL Publication Number
- NREL/CP-5K00-75037
Keywords
- Combined-Accelerated Stress Testing
- Electrically-Conductive Adhesives
- Module Characterization
- Silicone encapsulant